Abstract
This paper describes a new process for the vertical co-integration of AlSi MEMS tunable capacitors and thick-Cu high-Q inductors. Tunable area MEMS capacitors with fragmented electrodes and with both thermal and electrostatic actuators are designed and validated. Thick copper layers are used for a double purpose: (i) to design and fabricate vertically integrated high-Q inductors and (ii) to define lateral electrostatic actuators for the MEMS capacitors. The achievable performances and flexibility associated with the new process to fabricate LC tanks are finally discussed.
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