Validation of a novel dielectric constant simulation model and the determination of its physical parameters

Abstract

Precise determination of the dielectric constant of microelectronic packaging materials is critical for the performance optimization of high frequency devices. Accurate empirical data, however, is difficult to obtain and often not available for these complex composite materials. In order to provide a basis for predictive model verification, dielectric analysis of a series of model microelectronic packaging materials was conducted. Physical characteristics of the composite constituents, including the morphology of the dispersed phase as well as the dielectric constant of the dispersed and host phases, were used to define the indeterminate variables. The results of these analyses provide a systematic verification of a newly developed physical model for predicting the effective dielectric constant of complex composite systems. The model considers an interphase zone surrounding each dispersed particle having unique physical and electrical characteristics. A physical interpretation is presented to explain the indeterminate variables incorporated in this model.