Abstract

We clarify the mechanisms of self-diffusion mediated by both vacancies and interstitials in silicon crystals. Südkamp and Bracht published carefully measured self-diffusion data for silicon and determined the vacancy-mediated diffusion coefficients from the difference between their new data and previous data of metal diffusion under consideration of a correlation factor. Instead, we analyzed their data using the vacancy properties: the formation energy was obtained from quenching experiments of silicon crystals in a hydrogen atmosphere, and the migration energy determined from low-temperature electron irradiation. The self-diffusion coefficient is given by the sum of the diffusion coefficients of the vacancy mechanism, 0.90 exp (−4.30 eV/kBT), and the interstitial mechanism, 6.9 × 102 exp (−4.8 eV/kBT) cm2 s−1.

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