Trends in single-wafer processing

Abstract

It is pointed out that one of the most significant trends in semiconductor manufacturing over the past three decades has been the gradual replacement of batch processing with single-wafer processing. Two other trends, the use of larger silicon wafers (to reduce manufacturing cost) and the necessity for more demanding process-performance specifications (to allow continued device circuit scaling), have driven this move to single-wafer equipment for many processes. It is now technically feasible to produce silicon integrated circuits with 100% single-wafer processing. In the next decade, it may also become economically feasible to do so. >