Abstract
It is pointed out that one of the most significant trends in semiconductor manufacturing over the past three decades has been the gradual replacement of batch processing with single-wafer processing. Two other trends, the use of larger silicon wafers (to reduce manufacturing cost) and the necessity for more demanding process-performance specifications (to allow continued device circuit scaling), have driven this move to single-wafer equipment for many processes. It is now technically feasible to produce silicon integrated circuits with 100% single-wafer processing. In the next decade, it may also become economically feasible to do so. >
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