Abstract
In this paper, we have described the importance of single-wafer processing (SWP) in semiconductor manufacturing. As compared to batch processing, reduced cycle time, better control of surface and interface properties, and reduced defect densities are some of the attractive features of SWP. We have provided the example of new SWP tools that have the answers to address virtually all process integration issues in dealing with new materials as well as conventional materials in ultra small dimensions. Driven by reduced I/O pitches, and emergence of system-on-chip, system-in-package or system-on-package as the driver of semiconductor growth, SWP tools have started to play an important role in the surface cleaning in IC assembly and packaging. Global acceptance of SWP in manufacturing can address the supply chain problem of the semiconductor industry.
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