Abstract
SUMMARY Two approaches for detection of interfacial weakness between an adhesive and adherend are proposed here. The first technique employs transverse waves at an angle of incidence chosen from numerically established angular characteristics of the reflection factor in the case of two elastic media connected by different boundary conditions. A comparison of experimental and theoretical results confirms the importance of frequency and angle selection. The second approach discussed here is based on plate wave behavior in three layered medium with imperfections on the individual interfaces. A selection of appropriate modes was obtained indirectly by a numerical analysis of the dispersion relations. The different degrees of sensitivity of the individual plate wave modes either to interfacial conditions or to changes in glue line thickness and its cohesive properties was underline.
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