Abstract
We, for the first time, have analyzed the contact structure dependent hot carrier effect in quarter-micron n-channel metal semiconductor field effect transistor (nMOSFETs). We measured the DC stressed current degradation characteristics, the substrate current characteristics, and the hot carrier induced photon emission characteristics of MOSFETs with W/L=20/0.25 microns having various contact structures. From experiments, we consistently observed that the degradation increases rapidly as the number of contact holes increases while current driving capability improves moderately. We also calculated the average electron temperature in devices with different contact structures from the energy distribution of emitted photons. The electron temperatures of 3- and 26-contact hole devices were about 4700 K and 6000 K, respectively. We have developed a HSPICE circuit model to simulate various contact structures. Both simulation and experimental results indicate that the current driving capability saturates at more than 5 contact holes of n-channel MOSFET with W/L=20/0.25 microns.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
