Abstract
Decoupling capacitors have been designed and included in high-speed packaging systems to avoid voltage drops across the power supply caused by interconnect inductance. They are also used to reduce simultaneous switching noise between the power supply and device I/O buffers. This paper will review three different measurement methods by which these capacitors were analyzed. It will discuss the possible detriments when making both low frequency and high frequency measurements on electronic packages and surface mount chip components using commercial instruments and fixtures. Two different types of high performance electronic packages with integral decoupling capacitors were analyzed. The models derived from the measurements were included in a circuit simulation to determine the effectiveness of decoupling noise between the device drivers and the system power supply. The results will provide insight into the effectiveness or these types of capacitors used within a high-speed electronic system.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
More From: IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.