Abstract
AbstractIntegration of three‐dimensional microcoils on high‐performance RF‐LSI is one of the key technologies to realize future wireless telecommunication services and hypersensitive capacitance sensor systems. We designed and fabricated monolithic three‐dimensional microcoils on an LSI substrate. The microcoil has long legs, which will minimize electromagnetic coupling to the LSI substrate. We succeeded in confirming the basic operation of the integrated oscillator circuit in the gigahertz frequency range. It was confirmed that process damage due to plasma ashing, heating at 200 °C, and sputter etching were not observed in the oscillation performance. © 2012 Wiley Periodicals, Inc. Electron Comm Jpn, 95(11): 49–56, 2012; Published online in Wiley Online Library (wileyonlinelibrary.com). DOI 10.1002/ecj.11404
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