Abstract
Owing to its numerous technological applications in the fields of integrated circuits and protective coatings, the TiAlN system has aroused increasing interest. The purpose of this paper is to propose a thermodynamic model and simulate its processing conditions. The calculation and optimization of the TiAlN ternary phase diagram was performed as the first step to modeling two competitive CVD processes used for the processing of titanium aluminum nitride coatings: low pressure chemical vapor deposition (LPCVD) and metal-organic chemical vapor deposition (MOCVD). Thermodynamic simulations of the processes have been used to investigate the effect of varying operating parameters and to predict the nature of the phases present at equilibrium. Calculations were then made on the TiAlNClHAr and TiAlNCHAr chemical systems, corresponding to the two CVD processes.
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