Abstract
Due to their high intrinsic axial thermal conductivity, carbon nanotube (CNT) arrays have generated much interest as next generation thermal interface materials. A significant barrier in their future use is CNT-substrate thermal boundary resistance. For this reason much research has been done in examining improved array adhesion methods. This paper models the thermal resistance of a novel interface structure which shows promise in achieving low thermal resistance and high mechanical compliance. Through the use of a thermal conductive adhesive attachment, overall thermal resistances below 1 mm2 KW−1 can potentially be achieved using a vertically aligned CNT array, which will enable development of future high performance electronic packages.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
