Thermal property characterization for enhancement of thermal conductivity of hybrid polymer composites

Abstract

Abstract Hybrid Polymer Composites (HPC) are the novel answer for high thermal resistivity and stability of composites under variable thermal conditions. In this work the effort has been made a study of thermal properties of silicon, copper inserted HPC (Glass – FCS). The HPC’s made by hand layup with compression machine moulding by non-heating moulding method at room temperature. Thermal properties of HPC’s Thermal Conductivity (K), Coefficient of Thermal Expansion (CTE) and Thermal Gravimetric Analysis (TGA) are found by experiment. Experiments conducted at different heat inputs to find K of each material, by the experimental readings, the results designates K of silicon inserted hybrid composite material increases as percentage of silicon increases in HPC’s. The value of coefficient thermal expansion decreases with increase in percentage of silicon and in TGA the failure of HPC material occurs at 285 °C and time of 25 min, very small amount of decline in mass of silicon filler HPC’s in TGA test. In comparison with copper hybrid polymer composites silicon hybrid polymer composites gives better and higher thermal conductivity results.