Abstract
The thermal effects of natural or forced convection cooling, component placement, and circuit and card orientation are discussed for tape automated bonding (TAB) components in a steady-state operating condition. Included is the effect of locating the low-profile TAB module in the downstream wake of larger surface-mount or pin-grid array components. Experimental data are presented which demonstrate the power limitations of the TAB components for parameters that encompass machine configurations ranging from personal computer workstations to midsize mainframes. The results of the study provide an indication of the thermal limitations of the TAB structure and present initial ground rules that should be incorporated into the placement of a TAB component for optimum thermal performance.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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