Abstract
This paper describes ways of simplifying the equations characterising the equilibrium shape of reflowed solder in the interconnection of TAB (Tape Automated Bonding) and MCR (Moulded Carrier Ring) components with negligible loss in accuracy. A drastic reduction of the numerical effort necessary to calculate the solder volume for fine pitch devices is achieved. The equations are applied to TAB and MCR packages which are hotbar‐soldered to a substrate. The results of these calculations are in good agreement with experimental data.
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