Abstract
The process of selecting TAB Outer Lead Banding (OLB) equipment is similar to that for selecting standard surface mount (SM) pick-and-place equipment; however, the options am more limited because TAB equipment has not yet reached the same, level of maturity. TAB equipment is seen by many as simply a logical extension to the fine pitch placement equipment on the market today because it provides a way of assembling even finer pitch components to the printed circuit board. However, in comparison to SMT processes, TAB technology is still in its relative infancy. There are fewer vendors and the opportunities to tailor the equipment selection to the expected volume and desired level of automation and capital investment is much more limited. In addition, a TAB OLB machine must perform functions that are not required of a conventional pick-and-place machine. The development process is correspondingly more complex because the equipment and the assembly process am tightly linked. Both vendors and users are beginning a now learning curve for OLB machines and their associated processes. This article will deal with the four basic functions of an OLB machine, outlining various technologies and equipment sets available for outer lead bonding, and a suggested methodology for selecting the optimum OLB equipment.
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