Abstract
A wafer-bumped TAB (tape automated bonding) device called the fine-pitch TAB device, which has been applied to a LCD (liquid crystal display) panel designed for a flat-panel display, is introduced and described. The devices, fabricated with flat-surface bumps and a straight side-wall structure instead of the conventional mushroom structure, have several important features, i.e. (1) the shear strength has an average value of 8.65*10/sup 3/ gr/mm/sup 2/, (2) the inner lead pitch (the bump pitch) is 100 mu m in the mass products, and a pitch of about 40 mu m is achieved in the test vehicle. The technique utilizes a triple layer of intermediate metals consisting of titanium, nickel, and palladium, applies the bump photoengraving process using a dry-film resist, uses the cyanide electroplating technique, and uses the ILB (inner lead bonding)/OLB (outer lead bonding) equipment with higher alignment accuracy. >
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