Abstract
In the past several years, multichip modules (MCMs) have become cost effective in many high-volume applications, including wireless technologies, telecommunications, workstations, and consumer products. One reason for this success is the development of low-cost and highly reliable packaging techniques. We discuss a packaging technique that permits us to offer customers multichip-module packages that are identical in outline to single-chip semiconductors, and conform to the standards of board assembly manufacturers. Molded MCM packages externally appear to be identical to single-chip packages, but they have a quite different internal structure, which can be ceramic, silicon, or organic laminate-based. MCMs consist of multiple-mounted and interconnected devices that offer integration advantages not available in other packaging technologies. This paper describes the characteristics of AT&Ts MCMs, and the technology of molding these structures. This molding technology offers higher reliability, higher yield, and lower cost to manufacture.
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