LTCC technology: where we are and where we're going. II

Abstract

New electronic systems for automotive/industrial/medical/aerospace applications will continue to challenge both packaging engineers and technology due to the increased performance requirements, higher densities, higher temperatures and limited space available. This challenge mandates the use of unique packaging techniques such as multi-chip modules (MCM) that must not only provide the increase circuit density but also the reliability, electrical and medical performance, thermal management, and hermeticity. The interest in MCM technology has focused on different packaging technologies such as laminate, ceramic, and thin film technologies. One such ceramic technology, low temperature co-fired ceramic (LTCC) tape technology, offers significant benefits over other established packaging technologies for high RF, high density and fast digital applications that could require hermetically and good thermal management. This paper addresses the current status of LTCC technology as well as new and promising developments that could make this the leading substrate and MCM packaging technology. All market indicators are predicting tremendous growth in the MCM market.