Abstract
Due to its specific structural features, the packaging technology is extraordinary significant for the conductive slip-ring (CSR) encapsulating with epoxy molding compounds (EMC). In this work, a modified vacuum packaging technology was put forward for which includes a soaking process.By the construction of the soaking models, the packaging technology was calculated by MATLAB and discussed. The soaking model reveals that the soaking time is strongly influenced by the space of the exhaust vent and the added pressure. When the soaking pressure is set at 6 atm with the vent of 0.02 mm width, the EMC can be completely soaked into the tiny spaces of the CSR in 5 min.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
