Abstract
Based on its specific structural features, the packaging technology is extraordinary significant for the conductive slip-ring (CSR) encapsulating with epoxy molding compounds (EMC). In this work, a modified vacuum packaging technology has been proposed which includes a pouring process.By the construction of the relevant models, the packaging technology was calculated by MATLAB and discussed. It indicates that the EMC can be easily poured into the concentric ring slit of the CSR only with a differential pressure of 200 Pa between the outside pressure and the inside pressure. On the bases of the experimental results; the EMC can easily flow up from the bottom to the top of the CSR packaging mold vertically.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
