Abstract
Due to its specific structural features, the packaging technology is quite essential for the conductive slip-ring (CSR) encapsulating with epoxy molding compounds (EMC). In this work, a modified vacuum packaging technology has been proposed which includes a pouring process and a followed soaking process. Based on the experimental results; the reliability of the CSR packaged obtains a significant improvement as its thermal stability and electric insulating property are obviously advanced, comparing with that fabricated by the normal vacuum packaging method.
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