Abstract
Merger and acquisition (M&A) cases and the speed of horizontal integration have increased rapidly in the integrated circuit (IC) packaging and testing industry. Therefore, cooperation with suitable strategic alliance partner is a vital success factor for enterprises. This study proposes a “comparative evaluation” model that searches out appropriate strategic alliances on the basis of the resampling model acquired via data envelopment analysis (DEA). The realistic public data of 20 companies was collected from 2015 to 2019 in the IC packaging and testing industry. The super slacks-based measure model was used to evaluate the performance before alliance in the period from 2015 to 2019. The resampling past–present–future model was used to forecast the performance in 2020–2024. Afterward, a future strategic alliance for comparative evaluation of efficiency was established. The results of the alliance were divided into the groups “ineffective” and “effective”. The results show that 11 companies in the “effective” group achieved both improvements and 8 companies in the “ineffective” group achieved only unilateral improvements. The comparison model describes the efficiency of both sides simultaneously, not only from the perspective of the target but also from the perspective of the partner company. The evaluation model proposed in the study enables enterprises to find suitable alliance partners.
Highlights
The integrated circuit (IC) industry in Taiwan has stood a crucial position in the world
The results showed that DMU4 (Pomina Steel corporation) is the most suitable partner for the target company
The number of replicas depends on the number of inputs, outputs, and decision making units (DMUs) [9]
Summary
The integrated circuit (IC) industry in Taiwan has stood a crucial position in the world. The IC packaging and testing industry accounts for 52% of global profits. The. IC industry supply chain starts with IC design, IC manufacturing, and IC packaging and testing. The IC supply chain is mainly composed of these three parts. IC packaging and testing are an important part of the semiconductor manufacturing process. Packaging is the process of protecting chips from external physical, chemical, and other environmental damage. The IC packaging and testing industry is downstream of the supply chain. According to a report released by Yole Développement [1], Taiwanese outsourced semiconductor assembly and test (OSATs) contributed to nearly 52% of revenue in 2018, and included some prosperous packaging and testing factories such as Advanced
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