Applying the fuzzy analytic network process to the selection of an advanced integrated circuit (IC) packaging process development project

Abstract

In the modern business environment, process technology evaluation and selection (PTES) is a crucial component of innovation in new product development (NPD). The most difficult task for project managers in PTES is to make the optimal technology choice for a Research and Development (R&D) project, and there are many attendant uncertainties and risks in process technology R&D projects for NPD. Recently, Integrated Circuit (IC) Packaging has become an equal part of the cost-performance equation in the silicon world, and packaging foundries have responded quicker than many other semiconductor companies to the rapidly changing requirements of chip-scale packaging. This facilitates the transfer of new technology from the assemblers to the chip suppliers. This study applies the fuzzy analytic network process (FANP) model to evaluate the strategic impact of new IC manufacturing technologies in firms within Taiwan’s IC packaging industry. Our study will determine the key decision-making factors affecting R&D project selection using FANP, and additionally we develop an optimal manufacturing process. As a case study, the ongoing “Controller IC packaging R&D project A” was chosen to minimize warpage of controller IC.