Abstract
The system used consisted of an MRC SM8500 rf diode sputtering module mounted on a standard Genevac coating plant. Metal, insulator and metal-insulator compound films have been prepared in the system and these are discussed in terms of sputtering rates and the uniformity of deposited material. Thickness uniformity was measured using 5 3-in. × 1-in. soda glass substrates laid side by side across the 5-in. dia substrate table, with a metal strip laid across a diameter giving rise to a step. Measurements of thickness were then made using multiple beam interferometery. The effects of gas pressure and electrode separation on thickness uniformity are discussed. The provision of a movable substrate table has made the system ideal for obtaining experimental evidence of theoretical relationships of the effects of temperature on the strain sensitivity of thin films without exposing the films to air. A straining rig has been constructed inside the vacuum system and measurements of both the strain coefficient of resistance and the temperature coefficient of resistance in vacuum are described.
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call