Abstract
A new Sn-45Bi-2.6Zn (wt%) alloy was developed to replace the eutectic Sn-58Bi alloy as a low-melting point solder alloy. A 112% increase in the tensile elongation (0.68 vs. 0.32 in strain) was obtained by increasing the Sn-to-Bi volume ratio by reducing the volume content of brittle Bi. A solidus temperature of 133 °C was calculated from the Sn–Bi–Zn ternary system. The calculation of phase diagram (CALPHAD) method was performed to help understand the melting behavior of Sn-45Bi-2.6Zn alloy.
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