Abstract
Polyimide (PI) films have been prepared by ionized cluster beam deposition (ICBD), and Kapton, which is the trademark of PI from DuPont, was also prepared. Copper was deposited by sputtering on PI films. We investigated the interfacial properties of these two systems by X-ray photoelectron spectroscopy (XPS), and the diffusion phenomena by Rutherford backscattering spectroscopy (RBS). In addition, the packing densities of these PI films were measured by a rotational analyzer (RA) type ellipsometer. Two Cu/PI systems are compared. We found that PI films deposited by ICBD (ICB-PI) have a higher packing density than Kapton. We found that Cu interacts with pyromellitic dianhydride (PMDA) part of PI in the form of Cu–C–N, Cu–C–O, Cu–N–O complex, and that the interface of Cu/ICB-PI is sharper than Cu/Kapton. We also found that less copper is diffused into ICB-PI than into Kapton. The diffusion coefficient of Cu/ICB-PI is 2.45×10-17–2.8×10-15 cm2/s at 300–390°C, the activation energy of Cu diffusion into ICB-PI is 1.75 eV and D0 for ICB-PI is 1.92 ×10-1 cm2/s. The Cu atoms diffused into PI as a form of Clusters.
Published Version
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