Abstract
In order to solve the problem of unclear factors affecting the physical characteristics of Press-Pack IGBT devices, this paper explores the influence characteristics of the two main external conditions of fixture pressure and heat dissipation capacity on the physical parameters of Press-Pack IGBTs by building IGBT models with different chip structure layout considering various physical characteristics of materials. The results show that the effect of fixture pressure on the stress characteristics of the device is more obvious than the heat dissipation ability of the device, and the water-cooling heat flux has more influence on the electrical-thermal characteristics of the device. The research results provide a reference for the external conditions and structure selection of Press-Pack IGBTs.
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