Experimental Research on Heat Dissipation at the Hot End of Semiconductor Refrigeration Chips

Abstract

TEC1-12705 and TEC1-12706 two types of semiconductor refrigeration chips were designed with different hot-end heat dissipation conditions. At the same time, a test device for heat dissipation of heat pipes for heat sinks with separate current input and two-stage refrigeration was designed, and the influence of hot-end heat dissipation conditions on cold-end temperature was analyzed. The test results show that the cold terminal temperature of the semiconductor refrigeration sheet is related to the heat dissipation capacity of the hot terminal. Under the condition of limited heat dissipation capacity, the cold terminal temperature decreases first and then increases with the increase of the input current; and under the condition of ensuring the heat dissipation capacity, the cold terminal temperature decreases with the increase of the input current and decreases with the decrease of the hot terminal temperature. The two-piece TEC1-12706 semiconductor refrigeration sheet adopts two-stage refrigeration with separate current input, and the minimum temperature of the cold terminal can reach −36,8°С. The test results show that improving the heat dissipation conditions of the hot end can improve the performance of a single semiconductor refrigeration sheet. At the same time, under the best heat dissipation conditions, the use of separate current input two-stage refrigeration can greatly reduce the temperature of the cold end, which is of great significance to improve the working temperature difference of the semiconductor refrigeration sheet.