Abstract
SummaryThe electrodeposition of some metals from non-aqueous solutions may permit the attainment of higher cathodic efficiencies and greater coating thicknesses as compared with deposition from aqueous systems. Further applications may arise in the development of methods for obtaining coherent, adherent coatings on active metals such as uranium or titanium. The present paper deals with the electrodeposition of copper. The available literature concerning the electrodeposition of copper from non-aqueous solutions has been reviewed. Preliminary studies of the electrodeposition of copper from CuSO4(-formamide, CuCl2-acetone, CuBr2-methyl cyanide, CuCl-methyl cyanide, CuI-methyl cyanide and CuI-pyridine solutions at 25°C have been made. Of these systems, only the CuI-methyl cyanide and CuI-pyridine systems showed any promise as electrolytes for the electrodeposition of copper coatings. Additions of ammonium iodide to these systems increased the electrical conductances of the solutions and refined the grain siz...
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