Abstract
The electrodeposition of copper and silver on polycrystalline ruthenium was studied by the potentiodynamic method, in aqueous and aprotic media (propylene carbonate). The electrodeposition of the first monolayer of copper occurs in a potential range more positive than the equilibrium Nernst potential and is clearly separated from the electrodeposition of bulk copper which can take place when the first monolayer is not complete. This layer exhibits some structural rearrangement with time. The presence of oxygenated species at the electrode surface inhibits to a large extent the electrodeposition of the monolayer and modifies noticeably the binding energy between adsorbent and substrate. The influence of adsorbed Cl − is rather complex: an inhibition of the upd monolayer and an acceleration of the electrodeposition of bulk Cu are observed. The electrodeposition of silver occurs, surprisingly, within a single potential region in aqueous solution as well as in organic solvent. This phenomenon is supposed to be due to the presence of oxygenated species (in aqueous solution) or of strongly adsorbed solvent molecules (organic medium).
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