Abstract
Abstract Recent progress in nanoparticle construction can be seen as a breakthrough in increasing heat transfer methods. The small size of particles and low volume fraction of particles leads to solving agglomeration and pressure drop problems and reduce the cost of storing and transporting nanofluids. Molecular dynamics simulation is one of the essential branches of computational physics that can predict various structures' atomic behavior. In this study, the effects of external electrostatic force and external electrical field on the density, velocity, temperature of atomic structures, and agglomeration of Fe3O4 nanoparticles in a copper microchannel are investigated. The results of the physical properties of this structure are estimated using molecular dynamics simulation and LAMMPS software. The results show that with increasing the applied external electrostatic force the maximum velocity is converged to 0.0071 A /ps. Also, adding an external electrical field to the simulated nanofluid, the maximum values of density, velocity, and temperature are estimated to 1.32 g/cm3, 0.0078 A /ps, and 345 K, respectively. The external electrical field has a significant and essential role in the agglomeration process in atomic structures. Finally, it is observed that by increasing the external electrical field, the time required for the agglomeration process increases to 2.26 ns.
Published Version
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