Abstract
The whisker phenomenon has caused the reliability issues which induce short circuit in the electronic manufacturing industries. The research is conducted to study on the formation of pure tin whisker under the control of stress and temperature with the application of mechanical indentation and the formation of whisker can be classified into distinct shape accordingly. The specified ranges of stress and surrounding temperature are set up accordingly to promote the whisker mechanism of pure tin whisker. The pure tin whisker formed is examined in term of morphology characterization via Optical Microscope and Scanning Electron Microscope to analyze on the effect of stress and temperature on the growth morphology of pure tin whisker. This report outlines the research in progress on the development of the pure tin whisker formation.
Published Version
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