Abstract

The effect of thermal aging temperature and external tension on the formation and growth of tin whisker from Sn electroplating coating was studied by use of scanning electron microscopy(SEM)in this article. It is shown that the unbiased temperature accelerates the formation and growth of tin whisker. However external tension do not obviously promote the formation and growth of tin whisker. After coating is added external tension in ambient temperature storage, the formation of tin whisker is completely inhibited. The compressive stress is necessary condition leading to the growth of tin whisker.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call