Abstract

The results of investigation of the surface of a copper substrate modified with titanium ions are presented. Using TEM it has been established that a multi-level micro- and nanoporous nanocrystalline structure is formed due to simultaneous ion etching, heating, radiation-stimulated diffusion in the surface layer of the metal substrate. When bombarded with titanium ions the intermetallic phases of the equilibrium diagram of the Cu-Ti are formed. The penetration depth of titanium into the copper substrate under ion treatment has investigated in detail. It has been found that the phase composition and the surface morphology are dependent on fluence of the ion treatment.

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