Abstract
Processing of copper substrates by Ti ions was carried out using «KVANT-03MI» equipment by means of a vacuum-arc ionic source with the titanium cathode. By X-ray and SEM methods it was established that after ionization in the surface layer of substrate the intermetallides of Cu-Ti system form. There is the CuTi3 preferred phase in surface layer of substrate depending on time of processing by Ti ions. The mechanism of formation of observable net structure of surface layer by sputtering of copper atoms by Ti ions the subsequent deposition and their crystallization in the form of microislets of CuTi3 intermetallide on surface of a copper substrate have been suggested.
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