Abstract
The results of investigation of the surface of a copper substrate modified by titanium ions are presented. Using TEM it has been established that a two-level micro- and nanoporous nanocrystalline structure is formed due to simultaneous ion etching, heating, radiation-stimulated diffusion in the surface layer of the metal substrate. When bombarded with titanium ions the phases of the equilibrium diagram of the Cu-Ti were formed with a characteristic dimension of the elements of the intermetallic “net” structure of 1–4 µm in size. The mechanical properties of the surface layer of the copper modified by titanium ions are studied.
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