Abstract
The feature size dependence of plasma etch rates has been the focus of recent theoretical and experimental study [1–3]. The effect, already problematic at submicron dimensions, can limit attainable structures and is expected to increase in importance as lateral dimensions are further reduced. In this paper, the models previously reported are developed further and a new nanostructure trench sectioning technique is used to extend etch rate measurements to features with lateral dimensions below 100 nm. The experimental results are compared to the new models.
Published Version
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