Abstract
We performed slip tests using 300 mm diameter wafers on an inner three-point symmetrical boat in a batch-type vertical furnace. The maximum temperatures necessary to avoid a slip are shown for low-oxygen content and heavily boron-doped wafers. After studying the dependence of slip extension on wafer-annealing time at temperatures above 1100°C, we discuss the influence of bending stress on slip extension. It is emphasized that inner three-point symmetrical support has an advantage that the resolved shear component of thermal stress is considerably lower than that in the peripheral support as well as that of bending stress is.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
