Abstract
With the system's frequency climbing, the final imaging quality has been affected by signal integrity problems of the high-speed link, which becomes a bottleneck of restricting the performance of the remote sensing camera system. In this paper, the design of high-speed photoelectric links between PCB in the electronic design of a space remote sensing camera has been taken as an example. The analysis of inter-board photoelectric interconnect links has been proposed, and the signal integrity simulation has been analyzed in the time domain and the frequency domain based on 3D electromagnetic models of high-speed serial links. Compared with the measure data, the eye diagram of simulation results was highly closed to the measured results, the relative error of eye height was 7.3%, and the error of eye width was 11.4%. The analysis method proposed in this paper could effectively predict attenuation and distortion of signal in high-speed serial links, and which could extensively to analysis the signal integrity of the inter-board photoelectric high-speed links.
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