Terrace Engineering of the Buffer Layer: Laying the Foundation of Thick GaN Drift Layer on Si Substrates

Abstract

AbstractVertical GaN‐on‐Si devices are promising for the next‐generation high‐voltage power electronics with low cost and high efficiency. However, their applications are impeded by the limited thickness of crack‐free GaN layers and high threading dislocation density (TDD) in the layer. Buffer layers are crucial for stress control while they usually behave with poor surface morphology, which causes early stress relaxation in GaN and limited thickness. Hereby, a terrace engineering approach for the buffer layers is proposed. Through tuning the supersaturation ratio, the terrace width can be manipulated and an atomically smooth AlGaN buffer layer can be realized, which effectively reduces the compressive stress relaxation and provides a firm foundation for thick GaN growth. As a result, a 7.5 µm thick GaN drift layer with TDD as low as 8.6 × 107 cm−2 is achieved on Si substrates. The room temperature electron mobility of the GaN drift layer can be raised up to 1210 cm2 V−1 s−1. The fabricated PiN diode shows a high breakdown voltage of 1058 V as well as a high on/off ratio of 1012. This work thus truly demonstrates the potential of high‐performance and low‐cost GaN‐based electronic as well as optoelectronic devices on Si platforms.