Abstract
Tensile tests were conducted using micro-sized specimens fabricated from constant current and pulse current electroplated Au. The micro-specimens were fabricated by a focused ion beam system and tested by a specially designed micro-mechanical testing machine. Fine-grained electroplated Au was achieved by the pulse current electroplating. Average grain size of the pulse current electroplated Au film was 0.77±0.33μm. Strengthening by grain refinement was observed from the micro-tensile test of the pulse current electroplated Au. The yield stress reached 387MPa. The results obtained in this study followed the Hall-Petch relationship well.
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