Abstract
Based on a theoretical analysis of the temperature dependence of the contact resistance Rc for an Au-Ti-Pd2Si-n+-Si ohmic contact, a current-transfer mechanism explaining the experimentally observed increase in Rc in the temperature range 100–380 K is proposed. It is shown that microwave treatment of such contacts results in a decrease in the spread of Rc over the wafer and a decrease in the value of Rc whilst retaining an increase in Rc in the temperatures range 100–380 K.
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