Synthesis of W-AG Nanoalloys and Computer Aided Thermal Analysis of W-AG Nanoalloys Based Heat Sink

Abstract

W-Ag finds applications in many frontier areas such as heat sinks and microwave absorbers for microelectronics devices, arcing tips, resistance welding electrodes, electrical contacts and heavy duty electronic contacts. These nanoalloys prepared by mechanical milling process result in highly dense product. Chemical approaches have significant advantages in terms of better stoichiometric control, purity and controllable particle size. The variation in chemical composition of these composites allows the match of thermal expansion coefficient with ceramic substrates used in semiconductor devices. In the present study, Ag nanoalloys with average sizes below 200 nm were prepared using tungsten powder and silver nitrate as precursors. Compositional characterization of W-Ag nanoalloys was carried out using portable XRF.The developed material i.e. W-Ag is used as heat sink application in which the heat sink is modeled and thermally analyzed for evaluation of heat flux. The heat flux obtained was compared with aluminum heat sink. It was perceived that W-Ag heat sink exhibited superiority in withstanding higher temperature. Whereas, heat sink designed from aluminum was limited with their parameter which is thermal conductivity.