Abstract
Mo-Cu alloys are used as heat sinks, microwave absorbers in microelectronic devices and as electric contacts in circuit breakers. Mo-Cu nanoalloys with average sizes below 200 nm were prepared using molybdenum powder and copper nitrate. Compositional characterization of Mo-Cu alloys was carried out using portable XRF. The developed material i.e. Mo-Cu is used as heat sink application in which the heat sink is modeled and thermally analyzed for evaluation of heat flux. The heat flux obtained was compared with heat sink made of aluminum. It was observed that the Mo-Cu heat sink exhibited superiority in withstanding higher temperature whereas, heat sink designed from aluminum was limited with their parameter which is thermal conductivity.
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