Abstract
Tungsten silicide was synthesized by multipulse XeCl laser irradiation of co-sputtered WSi mixtures 140 and 460 nm thick on single-crystal silicon wafers. It is shown that at certain equilibria between contradictory influences of the depth of melting, stress generation, intermixing and crystallization it is possible to grow good quality tungsten silicide. Silicide layers with only one crystalline phase (WSi 2) and with a resistivity of 170 μω cm were obtained after irradiation of a WSi film 140 nm thick with 10 laser pulses at a fluence of 0.9 J cm −2.
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