Abstract
Fused quartz exhibits excellent optical and mechanical properties. Achieving ultra-smooth polishing of fused quartz is of great significance. Nanoparticle jet polishing (NJP) utilizes the synergistic effects of physics and chemistry to achieve damage-free atomic-level material removal. However, the influence of the process parameters on the interaction between the polishing particle and the workpiece remains unclear. This study experimentally and theoretically explored the effects of the slurry concentration, temperature, and pH on material removal. A high volume fraction of polishing slurry leads to poor fluidity of the polishing slurry and poor wettability on fused quartz, which slows down the growth rate of material removal rate. The polishing environment temperature regulates the material removal rate by altering the Ce3+ content in the polishing slurry. The pH influences the material removal process by affecting the Ce3+ content and the adsorption state between the particles and the workpiece. Alkaline conditions are conducive to forming stable ≡Ce-O-Si ≡ chemical bond to improve the material removal rate. Conversely, the electrostatic force between particle and workpiece in strongly acidic and alkaline environment hinders chemical adsorption. This study contributes to the understanding of the material removal process in NJP, providing a theoretical basis for optimizing the polishing process and improving the material removal rate.
Published Version
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