Abstract
The emergence of ultrasonic vibration–assisted polishing technology has effectively improved the machining accuracy and efficiency of hard and brittle materials in the modern optical industry; however, the material removal mechanism of ultrasonic vibration–assisted polishing (UVAP) still needs to be further revealed. This paper focuses on the material removal mechanism of ultrasonic vibration–assisted polishing of optical glass (BK7), the application of ultrasonic to axial vibration, and the atomization of the polishing slurry; the material removal model was established. Based on the analysis of the relationship between the nominal distance d of the polishing pad and the actual contact area distribution, the prediction of the material removal profile is realized. In addition, the effects of different parameters on the material removal rate (MRR) were analyzed, including polishing force, spindle speed, abrasive particle size, ultrasonic amplitude, feed rate, and flow rate of polishing slurry. Based on the motion equation of abrasive particles, the trajectory of abrasive particles in the polishing slurry was simulated, and the simulation results show that the introduction of the ultrasonic vibration field changes the motion state and trajectory of embedded and free abrasive particles. The new model cannot only qualitatively analyze the influence of different process parameters on MRR, but also predict the material removal depth and MRR, providing a possibility for deterministic material removal and a theoretical basis for subsequent polishing of complex curved surfaces of optical glass.
Highlights
Optical glass (BK7) is widely used in optoelectronics, diffractive optical elements, biomedicine and other fields because of its excellent mechanical properties and chemical stability [1]
The models of shocking force and material removal rate (MRR) are derived, which take into account the elastic properties and non-uniformity of abrasive particles, and the mechanical properties of workpiece and abrasive particle Zhang [18] considered the lateral extension of the contact area, the periodic changes of polishing force and contact radius, modeled the local surface profile and material removal distribution function of ultrasonic vibration-assisted polishing (UVAP), and obtained that larger axial ultrasonic amplitude can improve the Preston coefficient through experiments
In order to better apply the UVAP technology to actual production, this paper draws the following conclusions: 1. The MRR model of UVAP of optical glass (BK7) based on ultrasonic atomization was established by analyzing the abrasive particle motion during the polishing, which can be used to predict the material removal profile and analyze the effect of different process parameters on the MRR
Summary
Optical glass (BK7) is widely used in optoelectronics, diffractive optical elements, biomedicine and other fields because of its excellent mechanical properties and chemical stability [1]. The models of shocking force and MRR are derived, which take into account the elastic properties and non-uniformity of abrasive particles, and the mechanical properties of workpiece and abrasive particle Zhang [18] considered the lateral extension of the contact area, the periodic changes of polishing force and contact radius, modeled the local surface profile and material removal distribution function of UVAP, and obtained that larger axial ultrasonic amplitude can improve the Preston coefficient through experiments. Wang [20] studied the mechanism of ultrasonic vibration assisted grinding (UAG) of hard and brittle materials, established the mathematical model of UAG of brittle materials, conducted in-depth research on the influence of input variables on grinding force and prediction of surface roughness, and obtained the advantages of UAG through theoretical analysis and experimental verification. This study can provide a theoretical basis for complex surfaces with UVAP
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
