The ultrasonic vibration–assisted polishing material removal model of tilted cylindrical polishing tool based on BK7 glass

Abstract

BK7 glass is widely used in various optical instruments as a common ceramic material. However, there are still several difficulties in the polishing process due to its material properties. Ultrasonic vibration–assisted polishing (UVAP) is used widely for its excellent material removal properties. However, there are few researches on the model of UVAP material removal for tilted. Therefore, this paper investigates this problem. A model of UVAP material removal was established for titled column polishing; The pressure distribution and velocity distribution in the contact zone were modeled by means of experiments and geometric analysis. A series of orthogonal experiments were conducted, and the experimental results showed that the coefficient of determination was above 0.9 after fitting the actual profile to the predicted profile. The results of the orthogonal experiments were also analyzed by ANOVA. The predict error of maximum removal depth was less than 13.12%. The error of material removal rate (MRR) was less than 9.24%. By power spectral density (PSD) analysis, it was found that the introduction of ultrasonic amplitude has a good effect on suppressing the medium and high-frequency errors on the machined surface. The novel model can be used to optimize machining parameters and provide theoretical support for complex parts polishing.