Surface wave communication-based wave guide design concerns for flip chip package-based integrated circuits with bump pitch sizes of 1.2 mm and above

Abstract

ABSTRACT The flip chip package (FCP) based integrated circuits supports millimetre wave frequency range (30 - 300 GHz), analysing the conditions for optimal signal transmission between the integrated circuits for FCP type being the primary essence of this article. The effective signal transmission occurs through a dielectric-coated conductor structure based on the surface wave communication phenomenon, known as a surface wave communication-based wave guide (SWW). The article focuses primarily on design considerations to build SWW for FCP applications at millimetre wave frequency ranges. The efficiency of the proposed waveguide was investigated in terms of power transmission capacity, voltage standing wave ratio (VSWR) and signal attenuation. The analysis comprises examining these parameters at the frequency range of 50 GHz to 150 GHz while taking into account varied degrees of waveguide dimensions and surface reactance. The measured results show that at the signal frequency of 100 GHz with dielectric and conductor thickness of 0.2 mm and surface reactance of 100 Ω, the suggested waveguide provides efficient signal transmission with approximately 0 dB signal attenuation, ideal high-power flow of 41,000 VA m 2 and VSWR of 1.2. Overall, this article provides insights on the design and performance of SWW for FCP applications at millimetre wave frequency band.