Abstract
Crucial issues in using copper thick film microcircuits, namely, surface treatment and bondability, are addressed. A multilayer multichip ceramic substrate package with copper thick film conductors was used for these experiments. Surface treatments for bondability specific to different types of bonding sites are discussed. Using a flip tape automated bonding (TAB) technology, the resultant bond interfaces were analyzed in the as-bonded as well as thermally aged conditions. Results indicate a metallurgically stable materials system which should exhibit long-term reliability. Specific recommendations on copper surface treatments and general guidelines on materials selection are made on the production of reliable copper thick film interconnections.
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call